Anodes for horizontal plating lines in Printed Circuit Board (PCB) manufacturing

Optimized performance for your horizontal plating.

De Nora anodes for PCB manufacturing are engineered to give you control, consistency, and cost savings in horizontal plating lines, where panels move horizontally through the plating bath for precise copper deposition.

Here’s how they enhance your operations:

• Uniform copper deposition.
  Achieve consistent copper deposition across every panel, even at high current densities, for reliable quality on multilayer, rigid, and flexible printed circuit boards.

• Reliable via filling.
  Ensure dependable filling of through-holes and vias for defect-free boards.

• Elimination of surface roughness.
  Produce smooth surfaces, minimizing rework and enhancing end-product performance.

• Minimum additive consumption.
  Proprietary DT coatings reduce carriers, brighteners, and levelers (without membranes), lowering chemical costs and extending bath stability.

• Lifecycle management.
  Recoating and valorization services keep anodes in use, reducing waste and maximizing ROI.